Technological solution for increasing the quality of crimped connections

Abstract

In this paper we propose a new technological solution for crimping, to increase the quality of crimped connections by reducing the contact resistance and increasing the connection reliability. The method use two adjacent crimp indents in opposite sides. To evaluate the quality of crimped connections we make experimental determinations of contact resistance corresponding to two crimp method: the first method uses one crimp indents and the second is a proposed method with two crimp indents. All the used samples are with 8 copper wires 7.1 × 3 mm2. After we measure the contact resistance, we compare the obtained values for the two crimp method and present the conclusions.