Impact of deep sub-ambient cooling on GSI interconnect performance

Abstract

It is shown that sub-ambient cooling can enhance the performance of GSI interconnects significantly if their design is re-optimized accordingly. Liquid-air cooling improves the latency of local interconnects significantly (e.g. 35% and 60% for 20 /spl mu/m long interconnects at 45 nm and 22 nm technology nodes, respectively), and makes semiglobal interconnects more than 150% faster. It also increases the number of bits per second that global interconnects can potentially transfer by more than 100%.