Optical Proximity Communication in packaged SiPhotonics

2008 5th IEEE International Conference on Group IV Photonics Pub Date : 2008-10-07 DOI:10.1109/GROUP4.2008.4638207

J. Cunningham, Xuezhe Zheng, I. Shubin, R. Ho, J. Lexau, A. Krishnamoorthy, M. Asghari, D. Feng, J. Luff, Hong Liang, C. Kung

引用次数: 27

Abstract

We report 10Gb/s optical-proximity-communication with reflecting mirrors micro-machined into Si and co-integrated to low loss SOI waveguides for chip to chip communication using a self-aligned-packaging mechanism with measured 4.0 dB coupling loss.

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封装SiPhotonics中的光学近距离通信

我们报告了10Gb/s光近距离通信，反射镜微加工成Si，并协集成到低损耗SOI波导中，用于芯片间通信，使用自对准封装机制，测量耦合损耗为4.0 dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2008 5th IEEE International Conference on Group IV Photonics

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