{"title":"An enhanced passivation layer for secure consumer integrated circuit devices","authors":"Bruce Ndibanje, Hoon-Jae Lee","doi":"10.1109/GCCE.2014.7031254","DOIUrl":null,"url":null,"abstract":"Consumer electronics devices have a common point called integrated circuit (IC). Among the most advanced integrated circuits are the microprocessors which control everything from computers and cellular phones to the USB. In this paper, a novel manufacturing technique to enhance the passivation layer which protects the ICs is presented where a stronger passivation layer is made from Ni-TiO2 composite coating and Tetraethyl orthosilicate compound (TEOS/O2). The Ni-TiO2 will provide a high wear resistance and improve the hardness while the Tetraethyl orthosilicate will protect the microprocessor against ultraviolet attack on the ICs passivation layer.","PeriodicalId":145771,"journal":{"name":"2014 IEEE 3rd Global Conference on Consumer Electronics (GCCE)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 3rd Global Conference on Consumer Electronics (GCCE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GCCE.2014.7031254","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Consumer electronics devices have a common point called integrated circuit (IC). Among the most advanced integrated circuits are the microprocessors which control everything from computers and cellular phones to the USB. In this paper, a novel manufacturing technique to enhance the passivation layer which protects the ICs is presented where a stronger passivation layer is made from Ni-TiO2 composite coating and Tetraethyl orthosilicate compound (TEOS/O2). The Ni-TiO2 will provide a high wear resistance and improve the hardness while the Tetraethyl orthosilicate will protect the microprocessor against ultraviolet attack on the ICs passivation layer.