Introduction of ALD Beryllium oxide gate dielectric for III–V MOS devices

T. Akyol, J. Yum, D. Ferrer, M. Lei, M. Downer, C. Bielawski, T. Hudnall, G. Bersuker, J.C. Lee, S. Banerjee
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引用次数: 1

Abstract

Using atomic layer deposited (ALD) Beryllium oxide (BeO) as a gate dielectric for the first time, we present improved surface channel MOSFETs on III–V substrates. We used a self-aligned gate-last process to fabricate MOSFETs on semi-insulating InP substrates with TaN gate electrode. The electrical characteristics of n-MOSFETs and MOS-Capacitors and physical characteristics of the BeO high-κ dielectric film were investigated and are summarized in this paper. BeO gate dielectric n-MOSFETs show excellent surface channel dc output characteristics, supporting high possibility of utilizing it in III–V CMOS technology.
III-V型MOS器件用ALD氧化铍栅电介质的介绍
本文首次采用原子层沉积(ALD)氧化铍(BeO)作为栅极介质,在III-V衬底上制备了改进的表面沟道mosfet。我们采用自对准栅末工艺在半绝缘InP衬底上用TaN栅电极制备了mosfet。本文对n- mosfet和mos电容器的电学特性以及BeO高κ介电膜的物理特性进行了研究和总结。BeO栅极介电n- mosfet具有优异的表面沟道直流输出特性,支持其在III-V CMOS技术中应用的可能性很大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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