{"title":"The reliability analysis of thermal design software system","authors":"D. Fedasyuk, M. Seniv, P. Serdyuk","doi":"10.1109/MEMSTECH.2008.4558757","DOIUrl":null,"url":null,"abstract":"For the software reliability testing the model of software reliability estimation, which is based on the random Poisson process, has been used, which determines and allows to forecast the software fault probability and its reliability in the set moment of time. The software environment of computer-aided testing for the verification of computational software for the solution of thermal conductivity problems has been developed. Keywords - software reliability,","PeriodicalId":265845,"journal":{"name":"2008 International Conference on Perspective Technologies and Methods in MEMS Design","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Perspective Technologies and Methods in MEMS Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSTECH.2008.4558757","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
For the software reliability testing the model of software reliability estimation, which is based on the random Poisson process, has been used, which determines and allows to forecast the software fault probability and its reliability in the set moment of time. The software environment of computer-aided testing for the verification of computational software for the solution of thermal conductivity problems has been developed. Keywords - software reliability,