The enabling solution of Cu/low-k planarization technology

Abstract

The electro-chemical polishing in DI water ("ECP-DI" technology) and the advanced CMP technology ("mC/sup 2/") are introduced, as a new noble low down-force planarization technology. Each process is developed for the Cu bulk polishing step of Cu/ultra low-k devices. The ECP-DI is governed by Faraday's law, and that principle involves 'di-plating' of only the part coming into contact with the ion exchange film. Advanced CMP is a process which is not governed by Preston's law, but by the dissolution law.