MULTI-PRIDE: a system for supporting multi-layered printed wiring board design

Proceedings of ASP-DAC '97: Asia and South Pacific Design Automation Conference Pub Date : 1997-01-28 DOI:10.1109/ASPDAC.1997.600124

Toshimasa Watanabe

引用次数: 0

Abstract

The purpose of the paper is to outline MULTI-PRIDE, a system for supporting multi-layered printed wiring board design. It consists of (i) circuit bipartition, (ii) placement and routing on each outside layer, (iii) modification of wiring and compaction, and (iv) routing on inside layers.

查看原文本刊更多论文

MULTI-PRIDE:支持多层印刷线路板设计的系统

本文的目的是概述MULTI-PRIDE，一个支持多层印刷线路板设计的系统。它包括(i)电路双分区，(ii)每个外层的放置和布线，(iii)修改布线和压实，以及(iv)内层的布线。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Proceedings of ASP-DAC '97: Asia and South Pacific Design Automation Conference

自引率

0.00%

发文量