{"title":"High critical electric field of thin silicon film and its realization in SOI high voltage devices","authors":"Shengdong Hu, Bo Zhang, Zhaoji Li","doi":"10.1109/EDSSC.2008.4760648","DOIUrl":null,"url":null,"abstract":"Taking threshold energy epsiv<sub>T</sub> into accounting for electron multiplying, the formula of silicon critical electric field E<sub>S,C</sub> is given as a function of silicon film thickness t<sub>s</sub> from an effective ionization rate alpha<sub>eff</sub>. E<sub>S,C</sub> is increasing with the decreasing of t<sub>s</sub> especially at thinner t<sub>s</sub>. 2-D simulative and some experimental results as well as the comparing with several other familiar expressions of electric field proved the proposed E<sub>S,C</sub> is valid for both thick and thin silicon film. Thin silicon film with high E<sub>S,C</sub> can be used to enhance dielectric field E<sub>I</sub> and increase vertical breakdown voltage V<sub>B,V</sub> of SOI high voltage devices. A high voltage SOI device with 80 nm silicon layer and 0.4mum dielectric layer is designed. A high E<sub>S,C</sub> of 134V/mum is obtained, which makes E<sub>I</sub> and V<sub>B,V</sub> reach to 416 V/mum and 178 V, respectively.","PeriodicalId":234055,"journal":{"name":"2008 IEEE International Conference on Electron Devices and Solid-State Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Conference on Electron Devices and Solid-State Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2008.4760648","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Taking threshold energy epsivT into accounting for electron multiplying, the formula of silicon critical electric field ES,C is given as a function of silicon film thickness ts from an effective ionization rate alphaeff. ES,C is increasing with the decreasing of ts especially at thinner ts. 2-D simulative and some experimental results as well as the comparing with several other familiar expressions of electric field proved the proposed ES,C is valid for both thick and thin silicon film. Thin silicon film with high ES,C can be used to enhance dielectric field EI and increase vertical breakdown voltage VB,V of SOI high voltage devices. A high voltage SOI device with 80 nm silicon layer and 0.4mum dielectric layer is designed. A high ES,C of 134V/mum is obtained, which makes EI and VB,V reach to 416 V/mum and 178 V, respectively.