The Effect of Back-Barrier on the Performance Enhancement of III-Nitride/β-Ga2O3 Nano-HEMT

G. Rao, Nistha Baruah, T. Lenka, Rajan Singh, N. Boukortt, H. Nguyen
{"title":"The Effect of Back-Barrier on the Performance Enhancement of III-Nitride/β-Ga2O3 Nano-HEMT","authors":"G. Rao, Nistha Baruah, T. Lenka, Rajan Singh, N. Boukortt, H. Nguyen","doi":"10.1109/EDKCON56221.2022.10032868","DOIUrl":null,"url":null,"abstract":"In this research article, the influence of AlGaN back-barrier on the device performance has been analyzed. The study has been conducted based on the effect on the breakdown characteristics and RF performance. The inclusion of back barrier helps to raise conduction band, which diminishes the leakage path below the buffer layer and also helps to contain the 2DEG in the narrow channel. Furthermore, the RF performance is improved by mitigating the conduction losses and short channel effects. The device having the features of Si3N4 passivation, recessed gate structure and the substrate used is β-Ga2O3. The enhancement in breakdown voltage, RF performance (fT & fmax) with the presence of AlGaN back barrier in proposed III-Nitride Nano-HEMT on the preferred β-Ga2O3 is observed in both the cases of with & without field-plate. So, the future of HEMT technology is promising with the ongoing improvements to fulfil operational needs.","PeriodicalId":296883,"journal":{"name":"2022 IEEE International Conference of Electron Devices Society Kolkata Chapter (EDKCON)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Conference of Electron Devices Society Kolkata Chapter (EDKCON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDKCON56221.2022.10032868","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In this research article, the influence of AlGaN back-barrier on the device performance has been analyzed. The study has been conducted based on the effect on the breakdown characteristics and RF performance. The inclusion of back barrier helps to raise conduction band, which diminishes the leakage path below the buffer layer and also helps to contain the 2DEG in the narrow channel. Furthermore, the RF performance is improved by mitigating the conduction losses and short channel effects. The device having the features of Si3N4 passivation, recessed gate structure and the substrate used is β-Ga2O3. The enhancement in breakdown voltage, RF performance (fT & fmax) with the presence of AlGaN back barrier in proposed III-Nitride Nano-HEMT on the preferred β-Ga2O3 is observed in both the cases of with & without field-plate. So, the future of HEMT technology is promising with the ongoing improvements to fulfil operational needs.
后势垒对iii -氮化物/β-Ga2O3纳米hemt性能增强的影响
本文分析了AlGaN背势垒对器件性能的影响。基于对击穿特性和射频性能的影响进行了研究。后屏障的加入有助于提高导带,从而减少缓冲层以下的泄漏路径,也有助于将2DEG包含在窄通道中。此外,通过减轻传导损耗和短通道效应,射频性能得到了改善。该器件具有Si3N4钝化、凹槽栅结构、衬底为β-Ga2O3等特点。在有场板和没有场板的情况下,在首选β-Ga2O3上存在AlGaN背势垒时,所提出的iii -氮化物纳米hemt的击穿电压、射频性能(fT和fmax)都得到了提高。因此,随着不断改进以满足操作需求,HEMT技术的未来前景广阔。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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