Investigating scattering parameters measurements for 50GHz highspeed Printed Circuit Boards (PCBs)

Hui Huang, Di Liu, T. Guan, Xinmeng Liu
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引用次数: 4

Abstract

This paper describes some investigations, made using coaxial launch connectors and microwave probes, into the scattering parameters (S-parameters) measurements for a highspeed Printed Circuit Boards (PCBs) by using Vector Network Analyzers (VNAs) operating at microwave frequency up to 50GHz. The grounded Coplanar Waveguide (GCPW) transmission line with Electromagnetic Band Gap (EBG) in ground planes as one reference standard for S-parameters of the general high-speed PCBs, of which characteristic impedance is 50 ohm, is predicted and analyzed from electromagnetic theory. The paper describes the impedance standard in detail and compares experimental results, obtained using a VNA operating in the 10MHz to 50GHz band, with values predicted by electromagnetic modeling software. The measurement is implemented after using Multiline Thru-Reflect-Line (Multi-TRL) algorithm by Wincal XE4.5. The impedance mismatch is analyzed by Time-domain Reflection (TDR) method.
50GHz高速印刷电路板(pcb)散射参数测量研究
本文介绍了利用同轴发射连接器和微波探针,利用工作在50GHz微波频率下的矢量网络分析仪(vna)对高速印刷电路板(pcb)散射参数(s -参数)的测量进行了研究。从电磁学理论出发,对普通高速pcb的s参数进行了预测和分析,并以接地平面上的电磁带隙(EBG)作为s参数的参考标准。本文详细描述了阻抗标准,并将工作在10MHz至50GHz频段的VNA得到的实验结果与电磁建模软件预测的值进行了比较。采用Wincal XE4.5多线透反射线(Multi-TRL)算法实现测量。采用时域反射(TDR)方法对阻抗失配进行了分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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