Dynamic Behavior of Breakdown Mechanisms in SiGe HBTs

Harrison P. Lee, Jeffrey W. Teng, Nelson E. Sepulveda-Ramos, J. Cressler
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Abstract

The goal of this work is to present a pulsed-voltage measurement scheme which allows separation of impact-ionization and self-heating effects in the lead-up to device breakdown in high-speed SiGe HBTs, and demonstrate that it enables probing of the dynamic behavior of the operative breakdown mechanisms. By leveraging pulsed-mode measurements, we show an interesting time-dependence of the dominant operative breakdown mechanism. Investigation of the time-dependence of breakdown will facilitate a better understanding of the dynamics of the RF safe operating area (RF-SOA) of SiGe HBTs, which is critical for extracting maximum performance in SiGe for highspeed circuits.
SiGe HBTs击穿机制的动力学行为
这项工作的目标是提出一种脉冲电压测量方案,该方案允许在高速SiGe HBTs器件击穿前分离冲击电离和自热效应,并证明它能够探测工作击穿机制的动态行为。通过利用脉冲模式的测量,我们展示了一个有趣的时间依赖性的主要操作击穿机制。研究击穿的时间依赖性将有助于更好地理解SiGe HBTs的RF安全工作区域(RF- soa)的动态,这对于在高速电路中提取SiGe的最大性能至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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