Embedded test solution as a breakthrough in reducing cost of test for system on chips

K. Iijima, A. Akar, C. McDonald, D. Burek
{"title":"Embedded test solution as a breakthrough in reducing cost of test for system on chips","authors":"K. Iijima, A. Akar, C. McDonald, D. Burek","doi":"10.1109/ATS.2002.1181729","DOIUrl":null,"url":null,"abstract":"The cost of test for SoCs (system-on-chips) is tremendous, especially for large and complex designs. Although the high price of ATE (Automatic Test Equipment) is recognized as the primary contributor of test cost, and is therefore most highlighted, high test costs are also caused by factors related to engineering flows ranging from design to manufacturing. In this paper, the discussion will focus on test cost reduction, with all such factors taken into account. A potential difficulty in this discussion is that it is generally difficult to achieve higher quality and lower cost at the same time. In working with several leading edge semiconductor companies in the United States and Japan, the authors have observed and analyzed the whole picture of current flows in design and manufacturing test, including quantitative study of the cost of test. Based upon the results of this analysis, a proposed solution is analyzed, based upon effectiveness in achieving two goals: higher quality and lower costs.","PeriodicalId":199542,"journal":{"name":"Proceedings of the 11th Asian Test Symposium, 2002. (ATS '02).","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 11th Asian Test Symposium, 2002. (ATS '02).","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS.2002.1181729","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

Abstract

The cost of test for SoCs (system-on-chips) is tremendous, especially for large and complex designs. Although the high price of ATE (Automatic Test Equipment) is recognized as the primary contributor of test cost, and is therefore most highlighted, high test costs are also caused by factors related to engineering flows ranging from design to manufacturing. In this paper, the discussion will focus on test cost reduction, with all such factors taken into account. A potential difficulty in this discussion is that it is generally difficult to achieve higher quality and lower cost at the same time. In working with several leading edge semiconductor companies in the United States and Japan, the authors have observed and analyzed the whole picture of current flows in design and manufacturing test, including quantitative study of the cost of test. Based upon the results of this analysis, a proposed solution is analyzed, based upon effectiveness in achieving two goals: higher quality and lower costs.
嵌入式测试解决方案是降低片上系统测试成本的突破口
soc(片上系统)的测试成本是巨大的,特别是对于大型和复杂的设计。尽管ATE(自动测试设备)的高价格被认为是测试成本的主要贡献者,因此是最突出的,但高测试成本也是由从设计到制造的工程流程相关因素引起的。在本文中,讨论将集中在降低测试成本上,并考虑到所有这些因素。这个讨论中的一个潜在困难是,通常很难同时实现更高的质量和更低的成本。在与美国和日本的几家领先的半导体公司合作的过程中,作者观察并分析了设计和制造测试的整个流程,包括测试成本的定量研究。基于此分析的结果,根据实现两个目标的有效性来分析建议的解决方案:更高的质量和更低的成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信