The triangle of power density, circuit degradation and reliability

J. Henkel, P. Montuschi
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Abstract

Power density will stay a major challenge for the foreseeable future. Despite orders-of-magnitude-improved efficiency, power consumption per area is sharply rising, mainly due to the limits of voltage scaling. To investigate the physical implications of high power densities, we must distinguish between peak and average temperatures and temporal and spatial thermal gradients because they trigger circuit-aging mechanisms and eventually jeopardize the reliability of an on-chip system. The talk starts by presenting some basic interdependencies in the triangle of power density, circuit degradation and reliability and continues with some solutions to mitigate the problem via, among others, power density-aware resource management and efficient power budgeting.
功率密度、电路退化和可靠性的三角关系
在可预见的未来,功率密度仍将是一个主要挑战。尽管效率有了数量级的提高,但单位面积的功耗却急剧上升,这主要是由于电压缩放的限制。为了研究高功率密度的物理影响,我们必须区分峰值和平均温度以及时间和空间热梯度,因为它们会触发电路老化机制,并最终危及片上系统的可靠性。讲座首先介绍了功率密度、电路退化和可靠性三角关系中的一些基本相互依赖关系,并继续介绍了通过功率密度感知资源管理和有效的功率预算来缓解问题的一些解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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