Hydrogen plasma treatment for Si waveguide smoothing

Jingnan Cai, Yu Wang, Y. Ishikawa, Y. Yamashita, Y. Kamiura, K. Wada
{"title":"Hydrogen plasma treatment for Si waveguide smoothing","authors":"Jingnan Cai, Yu Wang, Y. Ishikawa, Y. Yamashita, Y. Kamiura, K. Wada","doi":"10.1109/GROUP4.2011.6053727","DOIUrl":null,"url":null,"abstract":"We demonstrated that remote hydrogen plasma treatment on silicon ring resonators can smooth the Si waveguides at lower than 100 °C. This also provides a promising way to trim resonators for a designed add/drop wavelength.","PeriodicalId":141233,"journal":{"name":"8th IEEE International Conference on Group IV Photonics","volume":"171 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th IEEE International Conference on Group IV Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2011.6053727","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

We demonstrated that remote hydrogen plasma treatment on silicon ring resonators can smooth the Si waveguides at lower than 100 °C. This also provides a promising way to trim resonators for a designed add/drop wavelength.
氢等离子体处理用于硅波导平滑
我们证明了在硅环谐振器上进行远程氢等离子体处理可以在低于100°C的温度下使硅波导光滑。这也提供了一种很有前途的方法来为设计的加/降波长修剪谐振器。
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