S. Jauss, S. Schwaiger, W. Daves, S. Noll, O. Ambacher
{"title":"Charge trapping in gate-drain access region of AlGaN/GaN MIS-HEMTs after drain stress","authors":"S. Jauss, S. Schwaiger, W. Daves, S. Noll, O. Ambacher","doi":"10.1109/ESSDERC.2015.7324712","DOIUrl":null,"url":null,"abstract":"In this paper we investigate the drain stress behavior and charge trapping phenomena of GaN-based high electron mobility transistors (HEMTs). We fabricated GaN-on-Si MIS-HEMTs with different dielectric stacks in the gate and gate drain access region and performed interface characterization and stress measurements for slow traps analysis. Our results show a high dependency of the on-resistance increase on interfaces in the gate-drain access region. The dielectric interfaces near the channel play a significant role for long term high voltage stress and regeneration of the device.","PeriodicalId":332857,"journal":{"name":"2015 45th European Solid State Device Research Conference (ESSDERC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 45th European Solid State Device Research Conference (ESSDERC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2015.7324712","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
In this paper we investigate the drain stress behavior and charge trapping phenomena of GaN-based high electron mobility transistors (HEMTs). We fabricated GaN-on-Si MIS-HEMTs with different dielectric stacks in the gate and gate drain access region and performed interface characterization and stress measurements for slow traps analysis. Our results show a high dependency of the on-resistance increase on interfaces in the gate-drain access region. The dielectric interfaces near the channel play a significant role for long term high voltage stress and regeneration of the device.
本文研究了氮化镓基高电子迁移率晶体管(HEMTs)的漏极应力行为和电荷捕获现象。我们在栅极和栅极漏极通道区制备了具有不同介电层的GaN-on-Si miss - hemt,并进行了界面表征和应力测量,用于慢阱分析。我们的结果表明,导通电阻的增加高度依赖于栅极-漏极通路区域的界面。通道附近的介电界面对器件的长期高压应力和再生起着重要的作用。