Charge trapping in gate-drain access region of AlGaN/GaN MIS-HEMTs after drain stress

S. Jauss, S. Schwaiger, W. Daves, S. Noll, O. Ambacher
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引用次数: 6

Abstract

In this paper we investigate the drain stress behavior and charge trapping phenomena of GaN-based high electron mobility transistors (HEMTs). We fabricated GaN-on-Si MIS-HEMTs with different dielectric stacks in the gate and gate drain access region and performed interface characterization and stress measurements for slow traps analysis. Our results show a high dependency of the on-resistance increase on interfaces in the gate-drain access region. The dielectric interfaces near the channel play a significant role for long term high voltage stress and regeneration of the device.
漏应力作用下AlGaN/GaN mishemts栅极-漏极通道的电荷捕获
本文研究了氮化镓基高电子迁移率晶体管(HEMTs)的漏极应力行为和电荷捕获现象。我们在栅极和栅极漏极通道区制备了具有不同介电层的GaN-on-Si miss - hemt,并进行了界面表征和应力测量,用于慢阱分析。我们的结果表明,导通电阻的增加高度依赖于栅极-漏极通路区域的界面。通道附近的介电界面对器件的长期高压应力和再生起着重要的作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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