Improved performance of high power single emitter semiconductor diode laser by new submount

Abstract

The package material and structure critically influence the major characteristics of semiconductor laser diodes, such as thermal behavior, output power, electrical-to-optical efficiency and reliability. We have designed and fabricated the new submount package for high power semiconductor diode laser module, which was called direct bonded copper (DBC). It was found that the new submount-based module has 15% higher power and higher efficiency than that of the traditional aluminium nitride (AN) submount, due to the high thermal conductivity.