High drivability and high reliability MOSFETs with non-doped poly-Si spacer LDD structure (SLDD)

A. Shimizu, N. Ohki, H. Ishida, T. Yamanaka, N. Hashimoto, T. Hashimoto, E. Takeda
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引用次数: 3

Abstract

It was found that a MOSFET with a non-doped poly-Si spacer LDD (SLDD) structure has high current drivability and high reliability in deep submicron regions. The high gate-fringing field effect caused by this spacer introduces lower lateral electric fields and accumulated n/sup -/ regions. The thin SiO/sub 2/ films under the spacer, which vary the gate-fringing field, affect the performance, in particular the hot-carrier effects of the SLDD. Nondoped poly-Si is a good material for this spacer. SLDDs with thin SiO/sub 2/ films (Tsox) varying from 7 to 25 nm under the nondoped poly-Si spacer were investigated. Both the current drivability and the reliability of the SLDD structure strongly depend on Tsox and are better than for the LDD structure with a SiO/sub 2/ spacer (OLDD).<>
具有非掺杂多晶硅间隔层LDD结构(SLDD)的高驱动性和高可靠性mosfet
研究发现,采用非掺杂多晶硅间隔层结构的MOSFET在深亚微米区域具有高电流驱动性和高可靠性。该隔层引起的高栅边场效应引入了较低的侧向电场和累积的n/sup /区域。间隔层下的SiO/sub /薄膜改变了栅极边缘场,影响了SLDD的性能,特别是热载子效应。非掺杂多晶硅是一种很好的间隔材料。研究了在未掺杂多晶硅衬垫下具有7 ~ 25 nm SiO/sub /薄膜(Tsox)的sldd。SLDD结构的当前可驱动性和可靠性都强烈依赖于Tsox,并且优于带有SiO/sub / spacer (OLDD)的LDD结构
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