Optimization of the VeSFET Structure Dedicated to Basic Logic Cells in VeSTIC Technology

M. Palgan, A. Pfitzner
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引用次数: 1

Abstract

This paper presents a part of feasibility study of VeSTIC (Vertical Slit Transistor-based Integrated Circuit) technology. The goal is an area saving of logic cells designed in this technology by using junction-less VeSFET devices (Vertical-Slit Field-Effect Transistor). Thanks to their feature: two electrically symmetric gates, there is a possibility to greatly reduce the number of elements required to build digital circuits. The use of complementary pair of twin-gate VeSFETs enables to design two-input NOR or NAND cell composed of two instead of four transistors. The combination of the key device parameters: slit width and dopants concentration as well as gate oxide thickness have been established in order to obtain both OR and AND functionality in a single transistor, providing the best distinguishability of the logic states. In particular, we have confirmed that control of the same single bulk channel of VeSFET by two gates ensures to achieve very high drain current ratio (up to le6) corresponding to “11” and “10” input states in the case of the transistor of AND functionality, which is unattainable in other known technologies.
VeSTIC技术中专用于基本逻辑单元的VeSFET结构优化
本文对基于垂直狭缝晶体管的集成电路技术进行了部分可行性研究。目标是通过使用无结的VeSFET器件(垂直狭缝场效应晶体管)来节省在该技术中设计的逻辑单元的面积。由于它们的特性:两个电对称门,有可能大大减少构建数字电路所需的元素数量。利用互补的双栅vesfet对,可以设计由两个而不是四个晶体管组成的双输入NOR或NAND单元。为了在单个晶体管中获得OR和and功能,建立了关键器件参数的组合:狭缝宽度和掺杂剂浓度以及栅极氧化物厚度,从而提供了最佳的逻辑状态可区分性。特别是,我们已经证实,通过两个栅极控制VeSFET的相同单个体通道,可以确保在具有and功能的晶体管的情况下实现对应于“11”和“10”输入状态的非常高的漏极电流比(高达le6),这在其他已知技术中是无法实现的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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