Highly reliable STT-MRAM adopting advanced MTJs with controlled domain wall pinning

J. Park, J. H. Kim, J. M. Kim, J. Kim, D. Apalkov, A. Okada, H. Sato, J. Jeong, Y. Cho, U. Pi, Y. Kim, Y. S. Park, K. M. Song, K. Kim, D. Jeong, D. S. Kim, C. Kim, I. Kim, S. H. Han, K. Lee, J. Lee, Y. J. Song, G. Koh, B. Kuh, J. Lee, J. H. Song
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引用次数: 2

Abstract

We demonstrate highly reliable STT-MRAM whose array-level write error has been eliminated by lowering the density of domain wall pinning sites in the MTJs. The core part of investigation includes the identification and quantification of domain wall pinning sites, characterization and modeling of the pinning sites, and correlation of the density of pinning sites with array-level write error rate. The experimental results show that domain wall pinning is geometrically localized and reproduced upon the repeated writing cycles. By controlling the domain wall pinning, we obtain high-density MTJ array having superior reliability without notable trailing bits of write fail.
高可靠的STT-MRAM采用先进的mtj与可控域壁钉
我们展示了高可靠性的STT-MRAM,通过降低mtj中的畴壁钉住位点密度,消除了其阵列级写入错误。研究的核心部分包括域壁钉钉位点的识别和量化、钉钉位点的表征和建模,以及钉钉位点密度与阵列级写入错误率的相关性。实验结果表明,畴壁钉钉在几何上是局部化的,并在重复的写入周期中重现。通过控制域壁钉钉,获得了高可靠性的高密度MTJ阵列,且无明显的写入尾位失败。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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