Multi-programming environment for structure under pads (SUP) and via arrays pattern recognition automated classification system

S. Yusof, Lau Meng Tee
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Abstract

In today's IC Design, EDA tools are not limited to IC designer's toys. The application of EDA has expanded into a larger scope including generation and extraction of critical information of a design for yield, quality and reliability analysis.
多编程环境下结构垫(SUP)和通过阵列模式识别的自动分类系统
在今天的IC设计中,EDA工具并不局限于IC设计师的玩具。EDA的应用已经扩展到更大的范围,包括生成和提取设计的关键信息,以进行成品率、质量和可靠性分析。
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