High Carrier Mobility Sn-Doped Ge Thin-Films (< 50 nm) on Insulator by Interface-Modulated Solid-Phase Crystallization at Low-Temperature

X. Gong, C. Xu, T. Sadoh
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Abstract

Effects of introduction of a-Si under-layers on solid-phase crystallization of Sn-doped Ge on insulator have been investigated. By introduction of a-Si under-layers, energy barrier for carriers at grain-boundaries is significantly decreased. As a result, high carrier mobility of 200−300 cm 2 /Vs is realized for thin GeSn films (30−50 nm) grown with a-Si under-layers. This mobility is the highest among ever reported data for Ge and GeSn thin-films (≤50 nm) on insulator grown at low-temperatures (≤500°C).
低温界面调制固相结晶法制备高载流子迁移率sn掺杂Ge薄膜(< 50 nm
研究了在绝缘子上引入a-Si底层对掺锡锗固相结晶的影响。通过引入a-Si底层,晶界载流子的能垒显著降低。结果表明,采用a- si衬底生长的GeSn薄膜(30 - 50 nm)载流子迁移率达到200 - 300 cm 2 /Vs。在低温(≤500°C)下生长的绝缘体上的Ge和GeSn薄膜(≤50 nm)的迁移率是迄今为止报道的最高的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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