Analytical Model and Simulation Based Analysis of a Doped Si DG TFET Exhibiting Lower Subthreshold Slope

Supratim Das
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Abstract

A doped double gate uni-junction silicon-based novel Tunnel Field Effect Transistor (TFET) structure is proposed that exhibits lower subthreshold slope (10 mV/decade) and better ON to OFF current ratio (Ion/Ioff is in order of 107 at low supply voltage) compared to conventional double gate TFET structure. A simulation-based analysis of the proposed structure has been carried out with the help of 2D TCAD Sentaurus device simulator at different channel length values. A mathematical model is also developed to verify the result with simulation. Our proposed TFET structure is composed of one common p region which acts as both source and channel. Therefore the configuration is basically a p-n double gate TFET having a n+ pocket close to source side and another n+ pocket close to drain side. These pockets are created separately by using work function engineering technique on metal gate having different lengths and thicknesses and also by using high k and low k dielectric as oxide. The source side n+ pocket enhances tunneling probability thus increasing Ion and Ioff is controlled by another n+ pocket near drain side. Significantly lower subthreshold slope as observed from calibrated simulation of our proposed configuration makes this device more suitable for digital logic application.
基于解析模型和仿真的低阈下斜率掺Si DG TFET分析
提出了一种新型掺杂双栅单结硅基隧道场效应晶体管(ttfet)结构,与传统双栅ttfet结构相比,具有更低的亚阈值斜率(10 mV/ 10)和更好的ON / OFF电流比(低电源电压下离子/ OFF约为107)。利用2D TCAD Sentaurus器件模拟器在不同信道长度值下对所提出的结构进行了仿真分析。建立了数学模型,并进行了仿真验证。我们提出的TFET结构由一个共同的p区组成,该p区既充当源又充当通道。因此,配置基本上是一个p-n双栅极TFET,具有靠近源侧的n+口袋和靠近漏侧的另一个n+口袋。通过在不同长度和厚度的金属栅极上使用功函数工程技术,以及使用高k和低k电介质作为氧化物,分别创建了这些口袋。源侧的n+袋提高了隧穿概率,从而增加了离子,漏侧附近的另一个n+袋控制了离合。从我们提出的配置的校准模拟中观察到的显着降低的亚阈值斜率使该器件更适合数字逻辑应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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