{"title":"Analytical Model and Simulation Based Analysis of a Doped Si DG TFET Exhibiting Lower Subthreshold Slope","authors":"Supratim Das","doi":"10.1109/VLSIDCS47293.2020.9179745","DOIUrl":null,"url":null,"abstract":"A doped double gate uni-junction silicon-based novel Tunnel Field Effect Transistor (TFET) structure is proposed that exhibits lower subthreshold slope (10 mV/decade) and better ON to OFF current ratio (Ion/Ioff is in order of 107 at low supply voltage) compared to conventional double gate TFET structure. A simulation-based analysis of the proposed structure has been carried out with the help of 2D TCAD Sentaurus device simulator at different channel length values. A mathematical model is also developed to verify the result with simulation. Our proposed TFET structure is composed of one common p region which acts as both source and channel. Therefore the configuration is basically a p-n double gate TFET having a n+ pocket close to source side and another n+ pocket close to drain side. These pockets are created separately by using work function engineering technique on metal gate having different lengths and thicknesses and also by using high k and low k dielectric as oxide. The source side n+ pocket enhances tunneling probability thus increasing Ion and Ioff is controlled by another n+ pocket near drain side. Significantly lower subthreshold slope as observed from calibrated simulation of our proposed configuration makes this device more suitable for digital logic application.","PeriodicalId":446218,"journal":{"name":"2020 IEEE VLSI DEVICE CIRCUIT AND SYSTEM (VLSI DCS)","volume":"21 10","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE VLSI DEVICE CIRCUIT AND SYSTEM (VLSI DCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIDCS47293.2020.9179745","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A doped double gate uni-junction silicon-based novel Tunnel Field Effect Transistor (TFET) structure is proposed that exhibits lower subthreshold slope (10 mV/decade) and better ON to OFF current ratio (Ion/Ioff is in order of 107 at low supply voltage) compared to conventional double gate TFET structure. A simulation-based analysis of the proposed structure has been carried out with the help of 2D TCAD Sentaurus device simulator at different channel length values. A mathematical model is also developed to verify the result with simulation. Our proposed TFET structure is composed of one common p region which acts as both source and channel. Therefore the configuration is basically a p-n double gate TFET having a n+ pocket close to source side and another n+ pocket close to drain side. These pockets are created separately by using work function engineering technique on metal gate having different lengths and thicknesses and also by using high k and low k dielectric as oxide. The source side n+ pocket enhances tunneling probability thus increasing Ion and Ioff is controlled by another n+ pocket near drain side. Significantly lower subthreshold slope as observed from calibrated simulation of our proposed configuration makes this device more suitable for digital logic application.