The Strong Effect of Spectral Mode and Directional Electrical Field for Nuisance Filtering In Defect Inspection

Xingdi Zhang, Hungling Chen, Yin Long, Kai Wang
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Abstract

As shrinkage of design nodes and increase of pattern density, defects become more and more critical in the integrated circuit (IC) manufacturing. Capturing more defects is essential in defects reduction which is the key point in yield enhance. Broadband plasma (BBP) optical defect inspection systems are widely used for defect monitoring. For defect inspection recipe, the signal to noise ratio (SNR) of defects is the key parameter. The more the SNR is high, the more the defects are easily captured. Base on this, noise filtering is benefit to the development of the defect capture ratio. As design nodes shrink and pattern density increases, noise filtering is becoming more and more difficult. In this paper, spectral mode and directional electrical field were used in noise filtering in research and development of 14nm fin loop technology process.
光谱模式和方向电场对缺陷检测中滋扰滤波的强作用
随着设计节点的缩小和图案密度的增加,缺陷在集成电路制造中变得越来越重要。缺陷的减少是提高成品率的关键,而缺陷的捕获是减少缺陷的关键。宽带等离子体(BBP)光学缺陷检测系统广泛应用于缺陷监测。在缺陷检测配方中,缺陷的信噪比是关键参数。信噪比越高,缺陷越容易被捕获。在此基础上,噪声滤波有利于缺陷捕获比的发展。随着设计节点的缩小和图案密度的增加,噪声滤波变得越来越困难。本文在14nm翅片环路技术的研发过程中,将光谱模式和定向电场用于噪声滤波。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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