Layout options for stability tuning of SRAM cells in multi-gate-FET technologies

F. Bauer, K. Arnim, C. Pacha, T. Schulz, M. Fulde, A. Nackaerts, M. Jurczak, W. Xiong, K. T. San, C. Cleavelin, K. Schruefer, G. Georgakos, D. Schmitt-Landsiedel
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引用次数: 14

Abstract

We present an investigation of different layout options for multi-gate-FET (MuGFET) SRAM cell design. Measurement results for four different core cell layouts are shown. Two different gate stacks using single mid-gap metal gates and HfSiON/SiON gate oxides were investigated. Static noise margins (SNM) of 210 mV have been measured at IV VDD. Trade-offs for MuGFET SRAM cell design are explored. The impact on cell area and scalability is examined.
多栅极场效应管技术中SRAM单元稳定性调谐的布局选项
我们提出了不同的布局选项的多栅极场效应管(MuGFET) SRAM单元设计的调查。给出了四种不同芯单元布局的测量结果。采用单中隙金属栅极和HfSiON/SiON栅极氧化物制备了两种不同的栅极堆。在IV VDD下测得210 mV的静态噪声裕度(SNM)。探讨了MuGFET SRAM单元设计的权衡。研究了对小区面积和可伸缩性的影响。
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