Unveil the Black Box for Performance Efficiency of OEE for Semiconductor Wafer Fabrication

Chih-Min Yu, C. Kuo, Chih-Lin Chiu, Wei-Chin Wen, Minghua Zhang
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引用次数: 4

Abstract

This study has demonstrated practical viability of the proposed approach employing datamining technics, Neural Networks (NNs), to estimate the productivity of individual process tool sets in a semiconductor factory, and to assess the efficiency loss by 15 related individual input factors, which included “process time”, “number of recipes”, “usable tool”, “Q-time constrain”, “standard deviation of lot size”, “batch size”, “sampling rate”, “hot lot ratio” and etc.. An empirical study was conducted by using the equipment data of a real fab. The results showed that the proposed approaches can define performance efficiency of Overall equipment efficiency (OEE) more reasonable, which discover underlying factors for efficiency loss, and help to improve performace efficiency from 91.23% to 94.03%.
揭开半导体晶圆制造OEE性能效率的黑盒子
本研究证明了采用数据挖掘技术和神经网络(NNs)估算半导体工厂单个工艺工具组生产率的实际可行性,并通过15个相关的单个输入因素(包括“工艺时间”、“配方数量”、“可用工具”、“Q-time约束”、“批量标准偏差”、“批量”、“抽样率”、“热批率”等)评估效率损失。利用实际晶圆厂的设备数据进行了实证研究。结果表明,该方法能更合理地定义设备总效率(OEE)的性能效率,发现效率损失的潜在因素,将设备总效率从91.23%提高到94.03%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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