Design of an Optimal Heat Sink for Microelectronic Devices Using Entropy Generation Minimization

Abstract

The present article describes the design of an optimum rectangular microchannel heat sink typically used in microelectronics heat transfer management. We use the entropy generation minimization criterion to model the heat transfer process, and the spiral algorithm to solve it. For the scenarios we considered, optimum heat sinks using environmentally friendly ammonia (azane) performed about 17% better than those using air. Moreover, we observed that the thermal resistance related to the working fluid represents about 52 ± 16% of the total equivalent thermal resistance, whilst the thermal resistance related to convection phenomena only represents about 12 ± 6%.