A new power module packaging technology for enhanced thermal performance

Abstract

A new approach to packaging high performance power devices, Chip on Flex Power Overlay (POL) was presented. It was shown that the GE's cost effective POL power packaging technology is ideally suited for high heat flux and high performance applications. This is primarily due to the elimination of bond wires and the planar geometry which offers cooling of power devices from top, bottom or both sides of the power module. It was also shown that a cost effective, scalable high performance integral heat exchanger can maximize the thermal performance of POL technology thereby helping to utilize its full potential. Due to the excellent thermal and electrical performance, low weight, volume, and cost effectiveness GE's revolutionary POL technology sets a new standard for the future of packaging power electronics modules.