High-performance silicon MMIC interconnect for millimeter wave wireless communication

Abstract

This paper presents the authors' latest efforts to develop high performance interconnects for mixed signal silicon MMICs in the millimeter wave regime. The proposed silicon/metal/polyimide (SIMPOL) interconnect is extremely effective in reducing the crosstalk noise with low insertion loss. Measured results of a prototype test wafer demonstrate 0.33 dB/mm insertion loss at 30 GHz, and excellent noise isolation comparable to background noise over the entire frequency range up to 50 GHz.