Power Saturation Characteristics of GaAs/AlGaAs High Electron Mobility Transistors

A. Gupta, R. T. Chen, E. Sovero, J. Higgins
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引用次数: 12

Abstract

High electron mobility transistors (HEMTs) employing both single and quadruple GaAs/AIGaAs heterojunctions have been fabricated and tested for power at 10 GHz. The multiple heterojunction layer, with a two-dimensional electron gas (2-DEG) sheet carrier density of 3.2 x 10/sup12/ cm/sup -2/ significantly higher current capability (as required for microwave power devices) than the conventional structure where the 2-DEG density is limited to <= 10/sup 12/ cm/sup -2/. HEMTs with gate dimensions of 0.5 µm x 200 µm were mounted in X-band FET packages for rf evaluation. The QHJ HEMTs yielded a saturated power of 21 dBm (0.63 W/mm), small signal gain of 14.5 dB, power added efficiency of 39%, and third order IMD product of -19 dBc at saturation. The corresponding figures for the SHJ HEMTs were 18 dBm (0.32 W/mm), 15 dB, 43% and -14 dBc, respectively. These are the highest power densities yet reported for a HEMT.
GaAs/AlGaAs高电子迁移率晶体管的功率饱和特性
采用单和四层GaAs/AIGaAs异质结制备了高电子迁移率晶体管(hemt),并在10 GHz功率下进行了测试。该多异质结层具有3.2 × 10/sup12/ cm/sup -2/的二维电子气(2-DEG)片载流子密度,比传统结构(2-DEG密度限制在<= 10/sup12/ cm/sup -2/)具有显著更高的电流能力(微波功率器件所需)。栅极尺寸为0.5 μ m x 200 μ m的hemt安装在x波段FET封装中进行射频评估。QHJ hemt的饱和功率为21 dBm (0.63 W/mm),小信号增益为14.5 dB,功率增加效率为39%,饱和时三阶IMD积为-19 dBc。SHJ型hemt对应的数值分别为18 dBm (0.32 W/mm)、15 dB、43%和-14 dBc。这是迄今为止报道的HEMT的最高功率密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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