{"title":"An 850 MHz current feedback operational amplifier","authors":"S. Jost","doi":"10.1109/BIPOL.1992.274080","DOIUrl":null,"url":null,"abstract":"A monolithic DC-to-850 MHz, low-distortion current feedback operational amplifier fabricated in a complementary bipolar bonded wafer technology is described. Discussed are an approach for achieving low-input offset voltage without sacrificing common-mode range or gain bandwidth; design for expected package and board parasitics; the use of low-overhead, high-impedance signal mirrors in the gain stage; and inverting input bias current cancellation. The output clamp is described. A summary of the circuit's performance obtained from production and bench testing on multiple fabrication lots is presented.<<ETX>>","PeriodicalId":286222,"journal":{"name":"Proceedings of the 1992 Bipolar/BiCMOS Circuits and Technology Meeting","volume":"116 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1992 Bipolar/BiCMOS Circuits and Technology Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BIPOL.1992.274080","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
A monolithic DC-to-850 MHz, low-distortion current feedback operational amplifier fabricated in a complementary bipolar bonded wafer technology is described. Discussed are an approach for achieving low-input offset voltage without sacrificing common-mode range or gain bandwidth; design for expected package and board parasitics; the use of low-overhead, high-impedance signal mirrors in the gain stage; and inverting input bias current cancellation. The output clamp is described. A summary of the circuit's performance obtained from production and bench testing on multiple fabrication lots is presented.<>