Reworkable encapsulation

Abstract

Epoxy thermosetting plastics continue to be a mainstay for electronic packaging, because of their ability to provide high reliability at low cost, One negative associated with the use of epoxy thermosets is their intractability after curing, which prevents their removal for rework or recycling of microelectronic assemblies. As a solution to this problem, we report on the development of a new functional equivalent, thermosetting epoxy which is easily removed.