Dynamic performance analysis of a 3.3 kV SiC MOSFET half-bridge module with parallel chips and body-diode freewheeling

A. Hussein, B. Mouawad, A. Castellazzi
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引用次数: 12

Abstract

Recently, 3.3 and 6.5 kV power MOSFETs have been introduced. Based on the 3.3 kV device, a 100 A half-bridge power module has been developed, using parallel chips for current scaling and relying exclusively on the use of the transistors body-diode for current free-wheeling (i.e., no antiparallel external diode chips are used). This paper presents a thorough parametric characterization of the module switching performance. Single-chip and parallel-chip operation are investigated in both double-pulsea type tests and realistic singlephase inverter operation.
3.3 kV体二极管并联MOSFET半桥模块动态性能分析
最近又推出了3.3和6.5 kV功率mosfet。在3.3 kV器件的基础上,研制了100 a半桥功率模块,采用并联芯片进行电流缩放,完全依靠晶体管体二极管进行电流自由旋转(即不使用反并联外部二极管芯片)。本文对模块开关性能进行了全面的参数化表征。在双脉冲型试验和实际的单相逆变器运行中,研究了单芯片和并联芯片的运行方式。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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