Design of the Interconnected Mesh Power System (IMPS) MCM Topology

Proceedings of the International Conference on Multichip Modules Pub Date : 1994-04-13 DOI:10.1109/ICMCM.1994.753603

L. Schaper, S. Ang, Y. Low

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引用次数: 5

Abstract

A significant decrease in MCM substrate production cost can be achieved by reducing the number of substrate layers from the conventional four or five (power, ground, X signal, Y signal, pad) to two or three. Besides reducing direct processing steps, yield will also increase as defect producing operations are eliminated. This paper describes the Interconnected Mesh Power System (IMPS), a new interconnection topology which leverages the production technologies of fine line lithography and batch via generation to allow planar power and ground distribution, and dense signal interconnection, on only two metal layers. Several possible implementations of the topology in MOM-D and MCM-L are described. The approach to incorporating IMPS in a standard commercial MCM design system is presented. The impact of a preferential routing scheme and a standardized pad structure is described. The design of a test vehicle which characterizes both the signal transmission and power distribution properties of the IMPS topology is discussed. Preliminary results of electrical characterization are described.

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互联网格电力系统(IMPS) MCM拓扑的设计

MCM基板生产成本的显著降低可以通过将基板层数从传统的四或五层(电源、接地、X信号、Y信号、衬垫)减少到两或三层来实现。除了减少直接加工步骤外，由于消除了缺陷生产操作，产量也将增加。本文介绍了互联网状电源系统(IMPS)，这是一种新的互连拓扑结构，它利用细线光刻和批量通过生成的生产技术，仅在两个金属层上就可以实现平面电源和接地分布以及密集的信号互连。描述了momd和MCM-L中拓扑的几种可能实现。提出了将IMPS集成到标准商用MCM设计系统中的方法。描述了优先路由方案和标准化衬垫结构的影响。讨论了一种测试车的设计，该测试车既能表征IMPS拓扑的信号传输特性，又能表征其功率分配特性。描述了电特性的初步结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the International Conference on Multichip Modules

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