Characterization of FinFET SRAM cells with asymmetrically gate underlapped bitline access transistors under process parameter fluctuations

S. Salahuddin, Hailong Jiao, V. Kursun
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引用次数: 2

Abstract

Two new six-FinFET memory circuits with asymmetrically gate underlapped bitline access transistors are evaluated in this paper under process parameter fluctuations. The strengths of the asymmetrical bitline access transistors are weakened during read operations and enhanced during write operations as the direction of current flow is reversed. The average read static noise margin of the statistical samples with the asymmetrical memory cells is up to 75.8% higher as compared to the standard symmetrical six-FinFET SRAM cell under process parameter fluctuations. Furthermore, the average leakage power consumption with the asymmetrical memory cells is reduced by up to 19% as compared to the standard symmetrical six-FinFET SRAM cell under process variations in a 15nm FinFET technology.
非对称门迭位线存取晶体管的FinFET SRAM单元在工艺参数波动下的特性
本文在工艺参数波动的条件下,对两种新型非对称门迭位线存取晶体管六finfet存储电路进行了评价。非对称位线访问晶体管的强度在读操作期间减弱,在写操作期间由于电流方向相反而增强。在工艺参数波动下,非对称存储单元统计样本的平均读静态噪声裕度比标准对称六finfet SRAM单元高75.8%。此外,与15nm FinFET工艺变化下的标准对称6 FinFET SRAM电池相比,非对称存储电池的平均泄漏功耗降低了19%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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