{"title":"CMOS transistor reliability and performance impacted by gate microstructure","authors":"B. Yu, T. King, C. Hu, D. Ju, N. Kepler","doi":"10.1109/IRWS.1997.660278","DOIUrl":null,"url":null,"abstract":"This paper investigate the impact of CMOS (complementary metal-oxide-semiconductor) gate microstructure on the reliability and performance of deep-submicrometer CMOS transistors. The amorphous silicon (/spl alpha/-Si) gate provides better capability for suppression of boron penetration in p/sup +/ doped gate p-channel MOSFETs, but gate depletion in the /spl alpha/-Si gate is slightly more severe than that of the poly-Si gate. The gate-length-dependent gate-depletion effect, in which the difference in linear g/sub m/ between MOSFETs with two different gate microstructures shows a strong L/sub g/-dependence, is reported and interpreted by impurity diffusion along the grain boundary. A gate nitrogen implant as an effective method for suppression of the boron diffusion is also discussed with emphasis on the impact on both device reliability and performance.","PeriodicalId":193522,"journal":{"name":"1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.1997.660278","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper investigate the impact of CMOS (complementary metal-oxide-semiconductor) gate microstructure on the reliability and performance of deep-submicrometer CMOS transistors. The amorphous silicon (/spl alpha/-Si) gate provides better capability for suppression of boron penetration in p/sup +/ doped gate p-channel MOSFETs, but gate depletion in the /spl alpha/-Si gate is slightly more severe than that of the poly-Si gate. The gate-length-dependent gate-depletion effect, in which the difference in linear g/sub m/ between MOSFETs with two different gate microstructures shows a strong L/sub g/-dependence, is reported and interpreted by impurity diffusion along the grain boundary. A gate nitrogen implant as an effective method for suppression of the boron diffusion is also discussed with emphasis on the impact on both device reliability and performance.