Impact of MOS technological parameters on the detection and modeling of the soft breakdown conduction

E. Miranda, J. Suñé, R. Rodríguez, M. Nafría, X. Aymerich
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引用次数: 1

Abstract

Several models have been proposed to explain the I-V characteristic associated with the soft breakdown (SBD) failure mode in ultrathin gate oxides. However, because of the fact that the SBD experimental detection window depends not only on the technological parameters of the device under test, which set the fresh I-V characteristic of the sample, but also on the strength of the breakdown event, there is still a large disagreement about its functional form. In this paper, we show that a power law, for applied voltages less than approximately 3.5 V, and an exponential law for higher voltages are suitable fitting models.
MOS工艺参数对软击穿导通检测与建模的影响
已经提出了几种模型来解释与超薄栅极氧化物软击穿(SBD)失效模式相关的I-V特性。然而,由于SBD实验检测窗口不仅取决于被测设备的工艺参数,即设置样品的新鲜I-V特性,而且还取决于击穿事件的强度,因此对其功能形式仍有很大的分歧。在本文中,我们证明了幂律(适用于小于约3.5 V的施加电压)和指数律(适用于更高电压)是合适的拟合模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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