Characterization and modeling of simultaneously fabricated DMOS and VMOS transistors

S. Combs, D. D'Avanzo, R. Dutton
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引用次数: 2

Abstract

A process has been designed which allows the simultaneous fabrication of V-groove MOS (VMOS) and double-diffused MOS (DMOS) transistors. The main objective of this work was to characterize and compare the physical and electrical properties of the two MOS devices. Physical parameters of the VMOS transistors were extracted from their vertical impurity profile measured by spreading resistance. The measured channel lengths and peak impurity concentrations were correlated with the gain factor and threshold voltage for several fabrication schedules. Properties of the lateral impurity profile were inferred from a comparison of the electrical characteristics of the VMOS and DMOS devices. In order to accurately model device performance in the saturated region, a one-dimensional solution of Poisson's equation was derived for the region surrounding the channel-substrate junction.
同时制造DMOS和VMOS晶体管的特性和建模
设计了一种同时制备v型沟槽MOS (VMOS)和双扩散MOS (DMOS)晶体管的工艺。这项工作的主要目的是表征和比较两种MOS器件的物理和电学性能。利用扩展电阻测量的垂直杂质分布曲线提取了VMOS晶体管的物理参数。测量的通道长度和峰值杂质浓度与增益因子和阈值电压有关。通过比较VMOS和DMOS器件的电特性,可以推断出横向杂质分布的性质。为了准确地模拟器件在饱和区域的性能,导出了通道-衬底结周围区域的泊松方程的一维解。
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