Adsorbed contamination on ceramic surfaces stored in industrial ambient conditions and its effect on epoxy bleed

O. Williams, C. Liu, D. P. Webb, P. Firth
{"title":"Adsorbed contamination on ceramic surfaces stored in industrial ambient conditions and its effect on epoxy bleed","authors":"O. Williams, C. Liu, D. P. Webb, P. Firth","doi":"10.1109/EPTC.2009.5416497","DOIUrl":null,"url":null,"abstract":"Maintaining cleanliness of substrates for assembly in optoelectronic modules is important where surfaces will be subjected to further processes in which the surface properties can affect performance. Cleanliness is counter productive when considering epoxy bleed, since the carbon based contamination of surfaces has been seen to reduce surface free energy and inhibit the spread of epoxy material. The origin of this contamination can be from a number of sources including atmosphere, handling, surface treatments and outgassing from storage media. Whilst allowing contamination to remain on the surface can be an effective means of controlling the epoxy bleed, it is not a reliable solution through lack of controllability. Identifying and quantifying this contamination will be a useful step towards the understanding and control of epoxy bleed, whilst its removal will homogenise all surfaces allowing controllable solutions to be implemented. The substrate materials of interest were aluminium oxide and aluminium nitride, which are commonly used in the optoelectronics industry. Storage methods used in industry were recreated for the purpose of this study with storage of samples in tin foil used for comparison. Samples were stored in commercial polymer waffle packs in a variety of atmospheres which they might experience in industry, on an industrial site, for one month. XPS measurements were made following storage to identify the composition of the contamination and its source. Both the degree of carbon contamination and the functional groups of any adsorbed species are known to affect surface energy and epoxy bleed. Therefore narrow band XPS spectra for carbon were analysed for all samples. Of the many methods which could be employed to remove the surface contamination, solvent, plasma cleaning and firing were chosen for their suitability and due to their availability to industry. XPS was performed on samples following cleaning. It was found that the composition of the contamination on the surfaces was not linked to their storage method but the quantity of contamination was. Storing ceramics in polymer waffle packs does not protect them from build up of carbon contamination regardless of storage atmosphere. The use of tin foil for storage can reduce the degree of contamination presence significantly, but not prevent build up entirely. A high degree of bleed was seen in both samples cleaned but not stored as well as in samples cleaned after storage, showing the effects of storage contamination are easily reversed. While storing ceramics for an extended period of time will allow build up of sufficient contamination to stop bleed occurring, samples fresh from suppliers will not have built up sufficient contamination to reduce the surface free energy to a degree such that bleed will not occur.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 11th Electronics Packaging Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2009.5416497","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Maintaining cleanliness of substrates for assembly in optoelectronic modules is important where surfaces will be subjected to further processes in which the surface properties can affect performance. Cleanliness is counter productive when considering epoxy bleed, since the carbon based contamination of surfaces has been seen to reduce surface free energy and inhibit the spread of epoxy material. The origin of this contamination can be from a number of sources including atmosphere, handling, surface treatments and outgassing from storage media. Whilst allowing contamination to remain on the surface can be an effective means of controlling the epoxy bleed, it is not a reliable solution through lack of controllability. Identifying and quantifying this contamination will be a useful step towards the understanding and control of epoxy bleed, whilst its removal will homogenise all surfaces allowing controllable solutions to be implemented. The substrate materials of interest were aluminium oxide and aluminium nitride, which are commonly used in the optoelectronics industry. Storage methods used in industry were recreated for the purpose of this study with storage of samples in tin foil used for comparison. Samples were stored in commercial polymer waffle packs in a variety of atmospheres which they might experience in industry, on an industrial site, for one month. XPS measurements were made following storage to identify the composition of the contamination and its source. Both the degree of carbon contamination and the functional groups of any adsorbed species are known to affect surface energy and epoxy bleed. Therefore narrow band XPS spectra for carbon were analysed for all samples. Of the many methods which could be employed to remove the surface contamination, solvent, plasma cleaning and firing were chosen for their suitability and due to their availability to industry. XPS was performed on samples following cleaning. It was found that the composition of the contamination on the surfaces was not linked to their storage method but the quantity of contamination was. Storing ceramics in polymer waffle packs does not protect them from build up of carbon contamination regardless of storage atmosphere. The use of tin foil for storage can reduce the degree of contamination presence significantly, but not prevent build up entirely. A high degree of bleed was seen in both samples cleaned but not stored as well as in samples cleaned after storage, showing the effects of storage contamination are easily reversed. While storing ceramics for an extended period of time will allow build up of sufficient contamination to stop bleed occurring, samples fresh from suppliers will not have built up sufficient contamination to reduce the surface free energy to a degree such that bleed will not occur.
工业环境条件下陶瓷表面吸附的污染物及其对环氧树脂出血的影响
保持光电模块中组装基板的清洁度非常重要,因为表面将受到进一步的处理,其中表面特性会影响性能。当考虑到环氧溢出时,清洁度是适得其反的,因为表面的碳基污染已经被认为会减少表面自由能并抑制环氧材料的扩散。这种污染的来源可能有很多,包括大气、搬运、表面处理和储存介质的放气。虽然允许污染物留在表面是控制环氧溢出的有效手段,但由于缺乏可控性,这不是一种可靠的解决方案。识别和量化这种污染将是理解和控制环氧渗漏的有用步骤,同时去除它将使所有表面均匀化,从而实现可控的解决方案。所研究的衬底材料是光电子工业中常用的氧化铝和氮化铝。为了本研究的目的,再现了工业中使用的储存方法,并将样品存放在锡纸中进行比较。样品被储存在商业聚合物华夫饼包装中,在工业现场可能经历的各种气氛中储存一个月。储存后进行XPS测量,以确定污染物的组成及其来源。已知碳污染程度和任何吸附物种的官能团都会影响表面能和环氧树脂出血。因此,对所有样品进行了碳的窄带XPS光谱分析。在许多可用于去除表面污染的方法中,溶剂、等离子体清洗和烧制被选择为它们的适用性和工业可用性。清洗后对样品进行XPS分析。研究发现,表面污染的组成与其储存方法无关,而与污染的数量有关。将陶瓷储存在聚合物华夫饼包装中并不能保护它们免受碳污染的影响,无论储存环境如何。使用锡纸储存可以显著降低污染的存在程度,但不能完全防止积聚。在两种清洗过但没有储存的样品中,以及在储存后清洗过的样品中,都可以看到高度的出血,这表明储存污染的影响很容易逆转。虽然长时间储存陶瓷将允许积聚足够的污染来阻止出血的发生,但从供应商那里新鲜的样品将不会积聚足够的污染来降低表面自由能到不会发生出血的程度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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