Frame vibration suppression for wafer transfer system

Abstract

The rapid development of the Integrated Circuit (IC) manufacturing equipment industry requires greater efficiency for wafer transfer. However, the faster wafer transfer robot moves, the bigger the force applied on its support frame is, and also the bigger vibration aroused on the frame because of the low stiffness of the support frame. Meanwhile, some IC equipment are ultra-high sensitive to the vibration. So the speed of the wafer transfer robot is limited by the vibration of the frame‥ In order to improve wafer transmission efficiency and synchronously reduce the vibration to the frame, in this paper, the rigid-flexible coupled dynamic model of wafer transfer robot was built, and then the vibration analysis of the robot on its support frame was discussed. After that the trajectory planning was used to suppress the force applied on the frame to reduce the vibration of the frame. Finally, the experiment system was built. The result shows that the vibration of the frame, while keeping the robot transmission efficiency, was clearly suppressed by using the bi-axis interpolation trajectory control.