Factors enhancing In0.7Ga0.3As MOSFETs and tunneling FETs device performance

H. Zhao, N. Goel, J. Huang, Y. Chen, J. Yum, Y. Wang, F. Zhou, F. Xue, J. Lee
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引用次数: 3

Abstract

We demonstrate key factors enabling mobility improvement at both low charge density and high density (>5×1012/cm2) in In0.7Ga0.3As quantum-well MOSFETs. We further show sub-threshold swing (SS) and on-current (Id) improvement in tunneling FETs (TFETs). By reducing EOT, optimizing the top-barrier/high-к interface, and confining carriers in In0.7Ga0.3As channel using In0.52Al0.48As bottom-barrier, SS and mobility of MOSFETs were improved from 152 to 99 mV/dec and from ∼2500 to ∼5000 cm2/V-s, respectively. TFETs achieved small SS (96 mV/dec) and high Id (55 µA/µm) due to low EOT and abrupt, vertical insitu grown III–V epitaxial junctions.
提高In0.7Ga0.3As mosfet和隧道fet器件性能的因素
我们展示了在In0.7Ga0.3As量子阱mosfet中,在低电荷密度和高密度(>5×1012/cm2)下提高迁移率的关键因素。我们进一步展示了隧道效应管(tfet)的亚阈值摆幅(SS)和导通电流(Id)改善。通过降低EOT,优化顶势垒/高通量界面,以及使用In0.52Al0.48As底势垒限制In0.7Ga0.3As沟道中的载流子,mosfet的SS和迁移率分别从152提高到99 mV/dec和从~ 2500提高到~ 5000 cm2/V-s。由于低EOT和突然垂直生长的III-V外延结,tfet实现了小SS (96 mV/dec)和高Id(55µA/µm)。
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