Recent Advances in Al2O3 "In-Situ" Moisture Monitoring Chips for Cerdip Package Applications

Abstract

Determination of the internal water vapor of a Cerdip package can be conveniently and inexpensively performed by an Al2O3 chip type sensor of recent design. Comparisons with an earlier design are made. Data of field trials by several IC manufacturers from common chip lots are shown. for the purpose of generating a broad range of moisture levels, both vitreous and non-vitreous sealing glass types were studied along with the effect of desiccants, lint contamination of the sealing glass, and the leak detection capability of the sensor. The relationship of sensor measured values with those of mass spectrometry is shown.