Surface finishes in PWB fabrication

Abstract

With the density of surface mount components increasing, ball grid array packaging (BGA) has become used more widely. The increased requirements on surface finish of printed wiring boards (PWB) turns out to be an even more important factor in current fabrication processes. In this paper, we introduced state of the art predominant finishes technologies and discussed their pros and cons. In addition, we show some related failure cases, which provide strong support for the above claim.