Bottom Nitridation Engineering of Multi-Nitridation ONO Interpoly Dielectric for Highly Reliable and High Performance NAND Flash Memory

C. H. Liu, Y. M. Lin, D. Yin, G. Tseng, H. Liaw, H. Wei, S. H. Chen, C. Chao, H. Hwang, S. Pittikoun, S. Aritome
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Abstract

The various methods of multi-nitridation ONO to improve NAND flash memory have been demonstrated in this paper. Excellent cell performance and reliability are obtained compared to convention ONO: (1) 1.9 V program voltage reduction owing to 23 A EOT (equivalant oxide thickness) reduction (2) More than 20% tighter cell Vt distribution width and 30% narrower Vth shift after 10 K cycling can be achieved by supressing ONO bird's beak encroachment of gate re-oxidation by floating gate (FG)/top oxide nitridation. MN-ONO is a promising technology for high density NAND flash beyond 40 nm generation.
用于高可靠高性能NAND快闪记忆体的多氮化ONO内插介电的底部氮化工程
本文介绍了多氮化ONO改进NAND闪存的各种方法。与传统ONO相比,获得了优异的电池性能和可靠性:(1)由于23 A EOT(等效氧化物厚度)降低,程序电压降低1.9 V;(2)通过浮栅(FG)/顶部氧化物氮化抑制ONO鸟嘴侵蚀栅极再氧化,可实现10 K循环后电池Vt分布宽度缩短20%以上,Vth移位缩短30%以上。MN-ONO是一种很有前途的40纳米以上高密度NAND闪存技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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