A running leap for embedded signal processing to future parallel platforms

B. Svensson, Zain-ul-Abdin, Per M. Ericsson, A. Ahlander, Hoai Hoang Bengtsson, Jerker Bengtsson, Verónica Gaspes, T. Nordström
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引用次数: 0

Abstract

This paper highlights the collaboration between industry and academia in research. It describes more than two decades of intensive development and research of new hardware and software platforms to support innovative, high-performance sensor systems with extremely high demands on embedded signal processing capability. The joint research can be seen as the run before a necessary jump to a new kind of computational platform based on parallelism. The collaboration has had several phases, starting with a focus on hardware, then on efficiency, later on software development, and finally on taking the jump and understanding the expected future. In the first part of the paper, these phases and their respective challenges and results are described. Then, in the second part, we reflect upon the motivation for collaboration between company and university, the roles of the partners, the experiences gained and the long-term effects on both sides.
嵌入式信号处理向未来并行平台的飞跃
本文强调了产业界和学术界在研究方面的合作。它描述了二十多年来对新硬件和软件平台的深入开发和研究,以支持对嵌入式信号处理能力有极高要求的创新高性能传感器系统。这项联合研究可以被看作是一种基于并行的新型计算平台的必要跳跃之前的运行。合作经历了几个阶段,从关注硬件开始,然后是效率,后来是软件开发,最后是跳跃和理解预期的未来。在论文的第一部分,描述了这些阶段以及各自面临的挑战和结果。然后,在第二部分中,我们反思了公司与大学合作的动机,合作伙伴的角色,所获得的经验以及对双方的长期影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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