Novel high power semiconductor module for trench IGBTs

Abstract

A new high power IGBT module is presented here, which is particularly suited for devices with low forward voltage drop, such as the latest trench IGBTs. The module design is versatile to cover a power range from 190 A to 1000 A, to enable integrated drive and protection functions, and to address different circuit topologies. Its unique construction features are spring pins to the gate and emitter of each individual IGBT chip, the elimination of wire bonding to power terminals, and scalable subunits. This results in lower losses, better cooling, and optimized parallelling of chips and modules.