Clean Dicing of Compound Semiconductors Using the Water-Jet Guided Laser Technology

The 17th Annual SEMI/IEEE ASMC 2006 Conference Pub Date : 2006-05-22 DOI:10.1109/ASMC.2006.1638759

D. Perrottet, S. Green, B. Richerzhagen

引用次数: 8

Abstract

The water-jet-guided laser is a new technology for micro machining that combines a laser beam into a hair-thin, low-pressure water jet for wafer dicing. In addition to silicon, it can dice compound semiconductors such as GaAs, InP and SiC without damage

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利用水射流激光技术对化合物半导体进行清洁切割

水射流制导激光是一种用于微加工的新技术，它将激光束结合成发丝般细的低压水射流，用于晶圆切割。除硅外，它还可以切割GaAs, InP和SiC等化合物半导体而不会损坏

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

The 17th Annual SEMI/IEEE ASMC 2006 Conference

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