Wafer-level packaging technology for MEMS

Abstract

This paper reviews the essential MEMS (Microelectromechanical Systems) silicon wafer processes that are needed for wafer-level packaging. Precision aligned wafer bonding is the key enabling technology for high-volume, low cost packaging of MEMS devices. State-of-the-art aligned silicon wafer bonding can provide not only basic MEMS device functionality, but also first-level assembly or packaging solutions for many MEMS devices. Numerous examples of high-volume production applications for wafer-level bonding will be described.