Impact of crystallinity of High-k oxides on Vt instabilities of NMOS devices assessed by physical and electrical measurements

X. Garros, P. Besson, G. Reimbold, V. Loup, T. Salvetat, N. Rochat, S. Lhostis, F. Boulanger
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引用次数: 9

Abstract

This paper investigates the impact of crystallinity of HfO2 oxides on VT instabilities. Wet etch rate measurements enhances a critical thickness tHK C for HfO2 which marks the transition between a monoclinic crystalline phase to a near amorphous state, both clearly identified by ATR FTIR. Using electrical measurements and modeling, it is demonstrated that this transition from the crystalline phase to an amorphous state is accompanied by a strong reduction of the density of bulk HfO2 defects responsible for electron trapping, Prevents the crystallization of an high-k layer is therefore fundamental to improve its BTI reliability.
高k氧化物结晶度对NMOS器件Vt不稳定性的影响
本文研究了HfO2氧化物结晶度对VT不稳定性的影响。湿蚀刻速率测量提高了HfO2的临界厚度tHK C,这标志着单斜晶相到近非晶态之间的转变,两者都可以通过ATR FTIR清楚地识别出来。通过电学测量和建模,证明了从晶态到非晶态的转变伴随着导致电子捕获的大块HfO2缺陷密度的大幅降低,因此防止高k层的结晶是提高其BTI可靠性的基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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