Inhibitation of substrate heating in a Minimal Multi-Target Helicon sputtering tool

Taichi Saito, Kazunori Takahashi, A. Ando, S. Hara
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Abstract

A minimal multi-target helicon sputtering tool has been developed for depositing a multi-layer metallic film in Minimal Fab System. In sputtering processes, high energy charged particles and recoil neutrals often flow into the substrate, resulting in an increase in a substrate temperature. Here the substrate temperature is investigated in a laboratory prototype of the minimal multi-target sputtering tool. Our experiment shows that the increase in the temperature can be successfully inhibited by installing a magnetic filter. This result implies that the increase in the substrate temperature is induced by secondary electrons from the target surface.
最小多目标螺旋溅射工具中衬底加热的抑制
研制了一种用于在最小晶圆系统中沉积多层金属薄膜的最小多目标螺旋溅射工具。在溅射过程中,高能带电粒子和反冲中性经常流入衬底,导致衬底温度升高。本文在实验室原型中研究了最小多靶溅射工具的衬底温度。我们的实验表明,通过安装磁性过滤器可以成功地抑制温度的升高。这一结果表明,衬底温度的升高是由靶表面的二次电子引起的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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